1,Our PCBA equipment
JUKI-2070LV Chip Mounter 1 set; Reflow Soldering Oven 4 sets
Auto Loader &auto-printing machine 6 sets; Wave soldering oven
ICT machine; AOI Detector 3 sets; Auto Solder Paste Printing Machine 6 sets
FUJI QP42 Chip Mounter 3 Sets; FUJI GP643 Chip Mounter 4 sets
JUKI KE-2050CM Chip Mounter 2 sets; JUKI KE-2060M Chip Mounter 1 set
Auto Picking Machine 3 sets
X-RAY 8200 1 set
Stencil Cleaner 1 set
2,Manufacturing Productivity
1)SMT productivity: 8 complete automatic SMT production lines, populating 7 million dots per day;
3,Can Do The Following Components Package
01005, 0201, 0402,0603,0805,1206,2512
QFP,QFN,CSP,TSOP,SOJ,BGA,uBGA,etc
4,Mounting Operational Capacity Parameters
Pcb layer:1-16layers; Pcb material:FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2
Pcb thickness:0.2mm-7.0mm; Pcb dimension:50*50mm-500*500mm
Copper thickness:0.5oz Min.;5.0oz Max; Chip accuracy:laser recognition±0.05mm;image recognition±0.03mm
Component size:0.6*0.3mm-33.5*33.5mm; Component height:6mm(max)
Pin spacing:laser recognition over 0.65mm;high resolution VCS 0.2mm
Spherical surface spacing:laser recognition over 1.0;high resolution VCS 0.25mm
BGA spherical distance: ≥0.25mm; BGA Globe distance: ≥0.25mm; BGA ball diameter: ≥0.1mm; IC foot distance: ≥ 0.2mm.
